IBM Power740 8205-E6D Server POWER7+

IBM Power 740 Express (Type 8205-E6D) Technical Specifications

The IBM Power 740 Express (8205-E6D) is a 1- or 2-socket, 4U rack-mount or tower server powered by 28nm POWER7+ processors. Designed as a high-density database and consolidation server for mid-sized enterprises, the 8205-E6D doubles the maximum RAM capacity of its POWER7 predecessor (up to 1024 GB DDR3) and features integrated hardware coprocessors for Active Memory Expansion (AME) and encryption.

System Summary & Architecture Specifications

Specification Category	Configuration / Feature Details
Machine Type / Model	IBM Power Systems 8205-E6D
Processor Architecture	64-bit IBM POWER7+ Processors (28nm technology)
Form Factor	4U Rack-mount drawer or Deskside Tower
Processor Sockets	1 or 2 Sockets
Core Configurations	6-core / 12-core @ 4.2 GHz 8-core / 16-core @ 3.6 GHz 8-core / 16-core @ 4.2 GHz
Cache Architecture	L1: 32KB I / 32KB D per core L2: 256KB per core L3: 10MB eDRAM per core (up to 160MB total for 16-core)
Memory Architecture	DDR3 ECC Registered Memory (RDIMM)
Max Physical RAM	Up to 512 GB (1 Socket) or up to 1024 GB / 1 TB (2 Sockets) across 32 DIMM slots
Virtual Memory Max	Up to 2 TB effective memory with Active Memory Expansion (AME)
Internal Drive Bays	Up to 8x SFF (2.5″) SAS HDD/SSD bays (up to 7.2 TB internal capacity)
Media Bays	1x Slimline DVD-RAM bay; 1x Half-height bay for tape or removable media
Virtualization Support	PowerVM Express, Standard, or Enterprise Edition

Detailed Subsystem Architecture

1. Processor & On-Chip Acceleration

• Process Technology: 28nm CMOS process with dual integrated memory controllers and embedded eDRAM L3 cache.

• Processor Module Options:

  • 6-core / 12-core 4.2 GHz POWER7+ (Feature Code #EPC7 / #EPC8)

  • 8-core / 16-core 3.6 GHz POWER7+ (Feature Code #EPC3 / #EPC4)

  • 8-core / 16-core 4.2 GHz POWER7+ (Feature Code #EPC5 / #EPC6)

• Integrated Co-Engines:

  • Hardware acceleration engine for Active Memory Expansion (AME) data compression/decompression.

  • High-speed AES cryptographic hardware acceleration.

2. Memory Subsystem

• DIMM Architecture: DDR3 RDIMMs with Chipkill ECC and Active Memory Maintenance.

• Slot Capacity: 8 base DIMM slots, expandable to 32 slots using 3 optional memory riser cards (8 slots per riser).

• DIMM Module Sizes: 8 GB, 16 GB, and 32 GB 1066 MHz / 1333 MHz memory features.

• Maximum RAM Configuration: 1024 GB (1 TB) on a 2-processor system.

3. Storage & SAS Subsystem

• Internal Backplane Options:

  • Standard Backplane: 6 or 8 SFF SAS drive bays with integrated SAS/SATA controller.

  • Expanded High-Function Backplane: 8 SFF SAS drive bays with dual 175 MB write-cache RAID (RAID 0, 1, 10, 5, 6) and external SAS port.

• Storage Compatibility: 10K/15K RPM SFF SAS Enterprise Hard Drives and Enterprise SAS SSDs.

4. I/O Expansion & Networking

• Integrated Adapter Slots:

  • 5x PCIe Gen2 x8 standard expansion slots.

  • 4x Low-profile PCIe Gen2 slots (optional riser card).

  • 2x GX++ slots for 12X I/O loop expansion drawers.

• Host Ethernet Adapter (HEA) Daughter Cards:

  • Quad-port 1 GbE RJ45 Adapter

  • Dual-port 10 GbE SFP+ + Dual-port 1 GbE Adapter

• External Expansion Support: Up to 4x PCIe 12X I/O drawers (adding up to 40 additional PCIe slots).

5. Operating System Support

• IBM AIX: AIX 6.1 (TL8 or later), AIX 7.1 (TL2 or later), AIX 5.3 (supported in compatibility mode).

• IBM i: IBM i 7.1 (TR5 or later), IBM i 6.1.1.

• Linux on Power: Red Hat Enterprise Linux (RHEL 6.3 or later), SUSE Linux Enterprise Server (SLES 11 SP3 or later).

6. Physical, Electrical & Power Specifications

• Chassis Dimensions (4U Rack):

  • Height: 173 mm (6.9 in)

  • Width: 440 mm (17.3 in)

  • Depth: 610 mm (24.0 in)

  • Weight: 39.5 kg (87.0 lbs) fully configured

• Power Subsystem:

  • Dual hot-plug, redundant power supplies (200 – 240 V AC).

  • Maximum Power Consumption: 1,630 W

  • Maximum Thermal Output: 5,562 BTU/hr

• Operating Temperature: 5°C to 40°C (41°F to 104°F).