Dell PowerEdge T630 — Technical Specifications & Product Overview

The PowerEdge T630 is a highly versatile, dual-socket rackable tower server designed to deliver ultimate performance, massive storage capacity, and high availability for demanding enterprise workloads (such as virtualization, databases, ERP, and business analytics).

1. System Architecture & Processing

• Processor Form Factor: Dual-socket (2S) 5U tower or rack-mountable layout.

• Processor Support: Up to two Intel® Xeon® E5-2600 v3 or v4 series processors.

• Processor Interconnect: Dual Intel QuickPath Interconnect (QPI) links.

• Chipset: Intel C612.

2. Memory (RAM)

• DIMM Slots: 24 DDR4 memory slots (12 DIMMs per processor).

• Memory Architecture: 4-channel memory per CPU.

• Supported RAM Types: Registered DIMMs (RDIMMs) and Load-Reduced DIMMs (LRDIMMs).

• Maximum Capacity:

  • Up to 1.5TB using 64GB RDIMMs.

  • Up to 3.0TB using 128GB LRDIMMs (with Intel Xeon E5-2600 v4 processors).

• Advanced Features: Advanced ECC, Memory Optimized independent channel mode, Memory Sparing, and Memory Mirroring.

3. Storage & Drive Bays

The T630 offers massive internal storage capabilities with four distinct drive chassis configurations:

Drive Chassis Variant	Max Drive Count & Type	Performance Focus
3.5″ Configuration (Max Storage)	Up to 18 x 3.5″ Hot-Plug SAS/SATA/NL-SAS HDDs/SSDs	Highest raw capacity
3.5″ with Flex Bay	Up to 8 x 3.5″ Hot-Plug SAS/SATA + optional Flex Bay options	Versatile mixed-media setup
2.5″ High-Density Chassis	Up to 32 x 2.5″ Hot-Plug SAS/SATA HDDs/SSDs	High IOPS database workloads
2.5″ NVMe Express Flash	Up to 16 x 2.5″ Hot-Plug SAS/SATA + 4 x optional NVMe Express Flash PCIe SSDs	Ultra-low latency acceleration

4. Storage Controllers (RAID)

• Internal Controllers: PERC S130 (Software), PERC H330, PERC H730, PERC H730P (with 2GB NVWC/Cache).

• External HBAs (RAID/Non-RAID): PERC H830.

5. Expansion I/O Slots (PCIe)

Features up to 8 PCIe slots for high I/O bandwidth:

• Slot 1: Full-Length, Full-Height (FL/FH) PCIe 3.0 x16 (from CPU1).

• Slot 2: FL/FH PCIe 2.0 x8 (x4 lanes, from PCH).

• Slot 3: FL/FH PCIe 3.0 x16 (from CPU1).

• Slot 4: Half-Length, Full-Height (HL/FH) PCIe 3.0 x8 (from CPU2).

• Slot 5: FL/FH PCIe 2.0 x8 (x4 lanes, from CPU2).

• Slot 6: FL/FH PCIe 3.0 x16 (from CPU2).

• Slot 7: FL/FH PCIe 3.0 x16 (from CPU2).

• Slot 8: FL/FH PCIe 3.0 x8 (from CPU1).

6. GPU Acceleration Support

• Supports up to 4 x 300W internal GPU processing accelerators (e.g., NVIDIA Tesla or Intel Xeon Phi) for high-performance computing (HPC) and VDI environments.

• Note: Requires the optional cooling fan assembly and specific redundant power supplies.

7. Networking & Connectivity

• Embedded NIC: Intel dual-port 1GbE LOM (Lan on Motherboard).

• Ports:

  • Front: 2 x USB 2.0, 1 x USB 3.0, 1 x iDRAC Direct (Micro-USB management port).

  • Rear: 2 x USB 2.0, 2 x USB 3.0, 1 x Serial connector, 1 x VGA port, 1 x Dedicated iDRAC network port, 2 x 1GbE RJ45 ports.

8. Management & High Availability

• Systems Management: iDRAC8 (Integrated Dell Remote Access Controller 8) with Lifecycle Controller (Express or Enterprise options).

• High Availability Features:

  • Hot-plug, redundant Power Supply Units (PSUs).

  • Hot-plug, redundant cooling fans.

  • Dual Internal SD Module (IDSDM) for hypervisor redundancy.

  • Single Device Data Correction (SDDC) and memory sparing.

9. Power Supplies

• Titanium Efficiency: 750W AC.

• Platinum Efficiency: 495W, 750W, 1100W, or 1600W AC.

• DC Options: Gold Efficiency 1100W DC.