Oracle Sun T4-4 SPARC 8 Core 3.0Ghz CPU Module 7046814, 7048833

Part Number Relationship & Identification

In Oracle’s replacement parts system, a single physical field-replaceable unit (FRU) is cataloged under several part numbers depending on whether you are looking at the bare board, the fully enclosed assembly, or the marketing part number.

• 7048833 (Marketing / Assembly Part Number): This represents the complete, factory-shipped Processor Module Assembly. It includes the 8-Core 3.0GHz CPU, the printed circuit board (PCB), the heavy-duty heatsink, and the metal outer protective enclosure tray with extraction latch handles.

• 7046814 (Board-Level Part Number): This is the part number etched directly onto the internal CPU/Memory Board (PCB) itself. If you slide the metal cover off the assembly tray, you will find this part number printed on the green motherboard silkscreen.

Technical Specifications

1. CPU & Performance Architecture

• Processor Family: SPARC T4 (S3 Core Architecture)

• Clock Speed: 3.0 GHz

• Physical Cores: 8 Cores per module

• Hardware Threads: 8 Threads per core (yielding 64 concurrent execution threads per module)

• Instruction Set: SPARC V9 (compliant with UltraSPARC Architecture 2011)

• On-Chip Cryptography: Dedicated cryptographic stream processing units integrated directly into each of the 8 cores. Hardware acceleration covers standard ciphers (AES, DES, 3DES, Camellia, SHA, RSA, ECC, DH) without taxing CPU compute performance.

2. Cache Infrastructure

• L1 Cache: 16 KB instruction cache and 16 KB data cache per core.

• L2 Cache: 128 KB write-through, fully associative L2 cache per core.

• L3 Cache: 4 MB shared L3 cache, accessed by all 8 cores via an on-chip crossbar switch.

3. Integrated Memory Subsystem

Each module behaves as a high-density memory riser, hosting 1/4th of the entire server’s maximum RAM capacity:

• Memory Slots: 16x DDR3 DIMM slots.

• Supported Memory Type: DDR3 Registered RDIMMs (ECC supported).

• Voltage: 1.35V (Low-Voltage) and 1.5V DDR3.

• Supported DIMM Capacities: 4 GB, 8 GB, and 16 GB.

• Total Capacity per Module: Up to 256 GB RAM.

Chassis Integration: SPARC T4-4 (5 RU)

The SPARC T4-4 system architecture relies on these modules to scale vertically. The server chassis has four designated front-loading slots (labeled PM0 to PM3) that interface directly with the system midplane.

Engineering & Maintenance Guidelines

Warning on Thermal Management & Airflow:

If you are running a partially populated SPARC T4-4 server, any empty processor module slots must be fitted with a mechanical filler panel (blank) to guide internal airflow. Running the server with an open slot will cause immediate cooling bypass, leading to thermal shutdown of the active modules.

• Module Placement Priority: Slots must be populated in sequential order, starting with PM0, then PM1, PM2, and finally PM3.

• Power/Cooling Requirements: Each populated module adds up to roughly 250W–300W of draw under load, requiring adequate configuration of the chassis’s redundant hot-plug power supplies.

• Software/OS Requirements: Requires Oracle Solaris 10 (Update 10 – 08/11) or later, or Oracle Solaris 11.

Part Number Cross-Reference Matrix

To help you with sourcing, inventory, or system diagnostic validation, here is how these part numbers relate to their corresponding assembly components:

Part Number	Component Type	Description
7048833	FRU Assembly	Complete 8-Core 3.0GHz Processor Module with tray enclosure
7046814	Bare PCB Board	Internal CPU/Memory Riser Board (silkscreen PN)
7014602	Mechanical	Outer metal drawer assembly/tray with locking levers
541-3512	Heatsink	Copper-base high-performance passive heatsink attached to the SPARC T4 CPU