Intel X550-T2 10GbE Dual-Port RJ45 Copper Adapter

Intel X550-T2 10GbE Dual-Port RJ45 Copper Adapter

SKU: X550-T2 分类:

Enterprise stock · tested · export documentation available

  • Intel Retail: X550-T2

  • HPE OEM Alternative: 562T (Stand-up PCIe adapter)

  • Dell OEM Part Numbers: 0C4D5P (Low Profile), 0HWWN0 (Standard Full Height)

  • Lenovo OEM Part Number: 0MM862

Technical Specifications

Overview & Architecture

  • Network Processor / Controller: Intel® Ethernet Controller X550-AT2

  • Bus Type: PCI Express 3.0 (8.0 GT/s)

  • Bus Width: x4 lane PCIe (operable in x8 and x16 slots)

  • Form Factor: Standard PCIe Plug-in Card (Low-profile and Full-height brackets available)

  • Connectors: 2 x RJ-45 Copper ports

Networking & Data Rates

  • Supported Data Rates Per Port: 10GbE, 5GbE, 2.5GbE, 1GbE, 100Mb/s (NBASE-T Multi-Gigabit Auto-Negotiation)

  • Cabling Distance & Media:

    • 10GBASE-T: Up to 100 meters using Cat6A / Cat7; up to 55 meters using Cat6

    • 1000BASE-T / Multi-Gigabit: Up to 100 meters using Cat5e, Cat6, or Cat6A

  • Jumbo Frames: Up to 9.5 KB (9500 bytes)

  • IEEE Compliance: 802.3an (10GBASE-T), 802.3ab (1000BASE-T), 802.1Q (VLANs), 802.3ad (Link Aggregation/LACP), 802.3x (Flow Control), 802.1p (CoS/QoS), 802.3az (Energy Efficient Ethernet).

Advanced Technologies & Offloads

Virtualization & Cloud Scale

  • Intel® Virtualization Technology for Connectivity (VT-c): Supports VMDq (Virtual Machine Device Queues) and SR-IOV (Single Root I/O Virtualization).

  • SR-IOV Capability: Up to 64 Virtual Functions (VFs) per port.

  • Flexible Port Partitioning (FPP): Virtualization of physical ports into multiple logical paths with custom bandwidth constraints.

  • Tunneling Offloads: VXLAN and NVGRE stateless offloads to preserve CPU cycles in virtualized overlays.

Performance Offloads

  • Storage Over Ethernet: Supported protocols include native iSCSI, FCoE, and NFS.

  • Stateless Offloads: TCP/UDP/IP Checksum Offload, Large Send Offload (LSO), Receive Side Scaling (RSS), and Transmit Segmentation Offload (TSO).

Electrical, Thermal & Physical Profiles

Power Consumption

The X550 architecture integrates the MAC and PHY into a single piece of silicon, significantly reducing thermal footprints compared to older X540 units:

Link Speed / Mode Typical Power Maximum Power
Dual-port 10 GbE 11.2 W 13.0 W
Dual-port 1 GbE 5.5 W 6.4 W
Dual-port 100 Mb/s 3.9 W 4.9 W

(Note: HPE 562T variants note an edge-case maximum board draw up to 15.56 W depending on active chassis cooling models).

Environmental & Physical

  • Operating Temperature: 0°C to 55°C (32°F to 131°F)

  • Storage Temperature: -40°C to 70°C (-40°F to 158°F)

  • Dimensions: Roughly 167 mm x 69 mm (Standard MD2 Low-profile design length)

Operating System & Ecosystem Compatibility

Fully supported across almost all enterprise network architectures:

  • Microsoft Windows Server: 2012, 2012 R2, 2016, 2019, 2022, 2025

  • Linux: Red Hat Enterprise Linux (RHEL) 6/7/8/9, SUSE Linux Enterprise Server (SLES) 11/12/15, Ubuntu, Debian.

  • Hypervisors: VMware ESXi 6.x / 7.x / 8.x, Microsoft Hyper-V.

  • Open Source: FreeBSD 11/12/13/14.

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