Supermicro SuperStorage / SuperServer 620P Series (SYS-620P / SSG-620P High-Density Storage Platform)

Supermicro SuperStorage / SuperServer 620P Series (SYS-620P / SSG-620P High-Density Storage Platform).

Product Overview

The Supermicro 620P Series is an enterprise-class, high-density 2U storage and compute platform powered by 3rd Gen Intel® Xeon® Scalable Processors (Ice Lake). Designed for data-intensive workloads, enterprise storage, big data analytics, and virtualization, it combines high drive density with flexible expansion and high-efficiency redundant power supplies.

Key Applications

• Enterprise Data Storage & iSCSI SAN / NAS

• Database Processing & Analytics

• Big Data & Hadoop Infrastructure

• Virtualization & High-Density Compute

• Cloud Backup, Archiving & Content Delivery Networks (CDN)

System Specifications

1. Processor & Architecture

Feature	Specification
CPU Sockets	Dual Socket P+ (LGA-4189)
Supported CPUs	3rd Gen Intel® Xeon® Scalable Processors (Ice Lake-SP)
CPU TDP	Supports up to 270W TDP (Air Cooled)
System Bus	3 UPI links up to 11.2 GT/s
Chipset	Intel® C621A

2. System Memory

Feature	Specification
Memory Capacity	Up to 4TB ECC DDR4-3200MHz
DIMM Slots	16 DIMM slots (8-channel per CPU)
Memory Types	3DS ECC RDIMM / LRDIMM DDR4-3200MT/s
Persistent Memory	Supports Intel® Optane™ Persistent Memory 200 Series
Operating Voltage	1.2V

3. Storage & Drive Bays

Feature	Specification
3.5″ Drive Bays	High-density hot-swap 3.5″ SAS3/SATA3 drive bays
Backplane	Single/Dual SAS3 12Gb/s Expander Backplane
Storage Controller	Broadcom / LSI 12Gb/s SAS3 Controller (IT Mode / HBA)
M.2 NVMe	1x or 2x M.2 NVMe slots (M-Key, 2280/22110) onboard
Rear Drive Bays	Optional 2x 2.5″ hot-swap SAS/SATA/NVMe drive bays for OS boot

4. Expansion Slots

Feature	Specification
PCIe Configuration	Up to 6x PCIe 4.0 slots (4x PCIe 4.0 x16 Low-Profile, 2x PCIe 4.0 x8 Low-Profile)
Flexible Networking	Optional AIOM / OCP 3.0 mezzanine card support

5. Networking & Management

Feature	Specification
Network Interfaces	Dual 10GbE RJ45 (Intel® X550) or Dual 1GbE RJ45 (Intel® i350)
BMC / Remote Mgmt	ASPEED AST2600 BMC with dedicated 1GbE RJ45 IPMI port
Management Features	IPMI 2.0, KVM over IP, Redfish API, Supermicro Server Manager (SSM), SPM, SUM

6. Power Supply & Cooling

Feature	Specification
Power Supply	Redundant (1+1) 1200W / 1600W Titanium Level (96% Efficiency) Hot-Plug Power Supplies
Input Voltage	100-240Vac / 200-240Vdc
System Fans	3 to 5 Heavy-duty hot-swap PWM cooling fans with optimal fan speed control

7. Physical & Environmental Specifications

Feature	Specification
Form Factor	2U Rackmount
Chassis Dimensions	Width: 17.2″ (437 mm) × Height: 3.5″ (89 mm) × Depth: 25.5″–34″ (647–864 mm)
Operating Temp.	10°C to 35°C (50°F to 95°F)
Non-Operating Temp.	-40°C to 60°C (-40°F to 140°F)
Relative Humidity	8% to 90% (Non-condensing)
Compliance	RoHS, FCC Class A, CE, UL/cUL